Zhenguo Jiang
9Patents
1h-index
23Co-inventors
43Inventor score
Filing activity: Apr 3, 2018 → Jan 22, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10672693B2 | Integrated circuit structures in package substrates | Electricity | 2 | Active |
| US11107757B2 | Integrated circuit structures in package substrates | Electricity | 1 | Active |
| US11937367B2 | Radio frequency front-end structures | Electricity | 1 | Active |
| US11482471B2 | Thermal management solutions for integrated circuit packages | Electricity | 0 | Active |
| US11729902B2 | Radio frequency front-end structures | Electricity | 0 | Active |
| US12200855B2 | Radio frequency front-end structures | Electricity | 0 | Active |
| US12003023B2 | In-package 3D antenna | Electricity | 0 | Active |
| US11611164B2 | Wideband multi-pin edge connector for radio frequency front end module | Electricity | 0 | Active |
| US11804426B2 | Integrated circuit structures in package substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.