Edge-notched substrate packaging and associated systems and methods
US11482504B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2020 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Sep 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/182
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for a semiconductor device having an edge-notched substrate are provided. The device generally includes a substrate having a front side, a backside having substrate contacts, and an inward notch at an edge of the substrate. The device includes a die having an active side attached to the front side of the substrate and positioned such that bond pads of the die are accessible from the backside of the substrate through the inward notch. The device includes wire bonds routed through the inward notch and electrically coupling the bond pads of the die to the substrate contacts. The device may further include a second die having an active side attached to the backside of the first die and positioned laterally offset from the first die such that the second bond pads are accessible by wire bonds around the edge of the first die and through the inward notch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.