Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component
US11487201B2 · kind B2 · utility
1Cited by
2References
14Claims
0Family size
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Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Nov 4, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer having an aliphatic cyclic skeleton; (C) a photopolymerization initiator; and (D) a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.