Method for controlling a lithographic apparatus and associated apparatuses
US11487209B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 15, 2018 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | May 28, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70641
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for controlling a lithographic apparatus, and associated apparatuses. The method is configured to provide product structures to a substrate in a lithographic process and includes determining optimization data. The optimization data includes measured and/or simulated data of at least one performance parameter associated with the product structures and/or their arrangement which are to be applied to the substrate in the lithographic process. Substrate specific metrology data as measured and/or modeled before the providing of product structures to the substrate is determined, the substrate specific metrology data including metrology data relating to a characteristic of the substrate to which the structures are being applied and/or the state of the lithographic apparatus at the time that the structures are applied to the substrate. The method further includes optimizing control of the lithographic apparatus during the lithographic process based on the optimization data and the substrate specific metrology data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.