Plasma processing apparatus, processing method, and upper electrode structure
US11488807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2020 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Jan 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for plasma processing includes a chamber, a lower electrode on which a substrate is placed in the chamber, an edge ring disposed around the lower electrode, an upper electrode facing the lower electrode in the chamber, a member disposed around the upper electrode, a gas supply section configured to supply a process gas to a space between the member and the lower electrode, and a power supply for applying radio frequency power to the lower electrode or the upper electrode to generate a plasma of the process gas. The member includes an inner member and an outer member positioned outside the inner member, and the outer member is disposed outside the edge ring in a radial direction. At least part of the outer member is movable in a vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.