Direct liquid cooling with O-ring sealing
US11488890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2020 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | May 22, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.