Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11493551B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2020 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Aug 13, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07378
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.