Patent · US Active

Integrated test cell using active thermal interposer (ATI) with parallel socket actuation

US11493551B2 · kind B2 · utility

20Cited by
53References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 5, 2020
Grant dateNov 8, 2022
Priority date
Expiry dateAug 13, 2040

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R1/07378
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.