Patent · US Active

Fan out package and methods

US11508637B2 · kind B2 · utility

0Cited by

8References

19Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Lizabeth Keser · Chandler, US
Thomas Ort · Veitsbronn, DE
Thomas Wagner · Regelsbach, DE
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Apr 22, 2020
Grant date	Nov 22, 2022
Priority date	—
Expiry date	Apr 22, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18162
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device and method is disclosed. Devices shown include a die coupled to an integrated routing layer, wherein the integrated routing layer includes a first width that is wider than the die. Devices shown further included a molded routing layer coupled to the integrated routing layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.