Semiconductor package and method
US11508656B2 · kind B2 · utility
7Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2021 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Jun 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.