Patent · US Active

Chip assembly

US11508694B2 · kind B2 · utility

1Cited by

6References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventor

Alexander Heinrich · Bad Abbach, DE

Key dates

Filing date	Mar 23, 2020
Grant date	Nov 22, 2022
Priority date	—
Expiry date	Mar 23, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1579
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.