Alexander Heinrich
74Patents
5h-index
94Co-inventors
71Inventor score
Filing activity: Aug 20, 2007 → Jun 21, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8177878B2 | Bonding material with exothermically reactive heterostructures | Electricity | 13 | Active |
| US11439762B2 | Data collection apparatus for attachment to an injection device | Human Necessities | 9 | Active |
| US8630748B2 | Method and apparatus for access and/or starting verification | Performing Operations; Transporting | 7 | Active |
| US10874802B2 | Data collection apparatus for attachment to an injection device | Human Necessities | 6 | Active |
| US11511047B2 | Data collection apparatus for attachment to an injection device | Human Necessities | 5 | Active |
| US11730891B2 | Data collection apparatus for attachment to an injection device | Human Necessities | 4 | Active |
| US11944796B2 | Data collection apparatus for attachment to an injection device | Human Necessities | 3 | Active |
| US8283756B2 | Electronic component with buffer layer | Electricity | 3 | Active |
| US9837381B2 | Method of forming a chip assembly with a die attach liquid | Electricity | 3 | Active |
| US10566309B2 | Multi-purpose non-linear semiconductor package assembly line | Electricity | 3 | Active |
| US8951915B2 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Electricity | 3 | Active |
| US11552042B2 | Solder material with two different size nickel particles | Electricity | 2 | Active |
| US9673170B2 | Batch process for connecting chips to a carrier | Electricity | 2 | Active |
| US9484316B2 | Semiconductor devices and methods of forming thereof | Electricity | 2 | Active |
| US10014275B2 | Method for producing a chip assemblage | Electricity | 2 | Active |
| US8980687B2 | Semiconductor device and method of manufacturing thereof | Electricity | 2 | Active |
| US9010884B2 | Backing piece for attaching an electrical component to a housing wall | Emerging Cross-Sectional Technologies | 2 | Active |
| US8828804B2 | Semiconductor device and method | Electricity | 2 | Active |
| US8802553B2 | Method for mounting a semiconductor chip on a carrier | Electricity | 2 | Active |
| US11547806B2 | Data collection apparatus for attachment to an injection device | Human Necessities | 1 | Active |
| US11508694B2 | Chip assembly | Electricity | 1 | Active |
| US11217047B2 | Method for verifying a predefined maximum spatial distance of a radio key in relation to a motor vehicle, as well as control device, motor vehicle and radio key | Physics | 1 | Active |
| US9034751B2 | Method for mounting a semiconductor chip on a carrier | Electricity | 1 | Active |
| US12023762B2 | Layer structure with an intermetallic phase layer and a chip package that includes the layer structure | Electricity | 1 | Active |
| US11842975B2 | Electronic device with multi-layer contact and system | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.