Thermally controlled lid stack components

US11515176B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Siva Chandrasekar · Hosur, IN
• Satish Radhakrishnan · San Jose, US
• Rajath Kumar Lakkenahalli Hiriyannaiah · Kanchinakote, IN
• Viren Kalsekar · Sunnyvale, US
• Vinay Prabhakar · Cupertino, US

Key dates

• Filing date: Apr 14, 2020
• Grant date: Nov 29, 2022
• Expiry date: Apr 14, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68771
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Exemplary substrate processing systems may include chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures through the lid plate and a second plurality of apertures through the lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the first plurality of apertures defined through the lid plate. Each lid stack of the plurality of lid stacks may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures.