Thermal profile monitoring wafer and methods of monitoring temperature
US11515218B2 · kind B2 · utility
0Cited by
9References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Jun 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Thermal monitors comprising a substrate with at least one camera position on a bottom surface thereof, a wireless communication controller and a battery. The camera has a field of view sufficient to produce an image of at least a portion of a wafer support, the image representative of the temperature within the field of view. Methods of using the thermal monitors are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.