Patent · US Active

Dislocation distribution for silicon carbide crystalline materials

US11519098B2 · kind B2 · utility

3Cited by
1References
46Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 29, 2020
Grant dateDec 6, 2022
Priority date
Expiry dateJan 11, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC30B23/02
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Silicon carbide (SiC) wafers, SiC boules, and related methods are disclosed that provide improved dislocation distributions. SiC boules are provided that demonstrate reduced dislocation densities and improved dislocation uniformity across longer boule lengths. Corresponding SiC wafers include reduced total dislocation density (TDD) values and improved TDD radial uniformity. Growth conditions for SiC crystalline materials include providing source materials in oversaturated quantities where amounts of the source materials present during growth are significantly higher than what would typically be required. Such SiC crystalline materials and related methods are suitable for providing large diameter SiC boules and corresponding SiC wafers with improved crystalline quality.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.