Wafer alignment markers, systems, and related methods
US11520240B2 · kind B2 · utility
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18References
20Claims
0Family size
Assignee
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Key dates
| Filing date | May 7, 2021 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | May 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54453
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of aligning a wafer for semiconductor fabrication processes may include applying a magnetic field to a wafer, detecting one or more residual magnetic fields from one or more alignment markers within the wafer, responsive to the detected one or more residual magnetic fields, determining locations of the one or more alignment markers. The marker locations may be determined relative to an ideal grid, followed by determining a geometrical transformation model for aligning the wafer, and aligning the wafer responsive to the geometrical transformation model. Related methods and systems are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.