Method and apparatus for measuring erosion and calibrating position for a moving process kit
US11521872B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2019 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Jun 14, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D5/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.