Hybrid embedded package

US11521907B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stefan Woetzel · Erfurt, DE
• Chee Yang Ng · Kluang, MY

Key dates

• Filing date: Oct 14, 2020
• Grant date: Dec 6, 2022
• Expiry date: Nov 11, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15174
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor package includes a substrate formed of electrically insulating material and having a die mounting surface, a first semiconductor die embedded within the substrate and comprising a first conductive terminal that faces the die mounting surface, a second semiconductor die mounted on the die mounting surface and comprising a first conductive terminal that faces and is spaced apart from the die mounting surface, and a first electrical connection that directly connects the first conductive terminals of the first and second semiconductor dies together, wherein the second semiconductor die partially overlaps with the first semiconductor die.