Semiconductor device and method for fabricating the same
US11521978B2 · kind B2 · utility
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2References
8Claims
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Key dates
| Filing date | Jun 28, 2021 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Jun 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B20/25
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application discloses a semiconductor device with a programmable unit and a method for fabricating the semiconductor device. The semiconductor device includes a substrate comprising a first region and a second region; a first semiconductor element positioned in the first region of the substrate; a second semiconductor element positioned in the first region of the substrate and electrically coupled to the first semiconductor element; and a programmable unit positioned in the second region and electrically connected to the first semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.