Method for making contact with a component embedded in a printed circuit board
US11523520B2 · kind B2 · utility
1Cited by
60References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2018 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Jan 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.