Method of manufacturing electronic devices and corresponding electronic device
US11524892B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 30, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Nov 18, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0792
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.