Methods and apparatus for intermixing layer for enhanced metal reflow
US11527437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Dec 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and apparatus for filling features on a substrate are provided herein. In some embodiments, a method of filling features on a substrate includes: depositing a first metallic material on the substrate and within a feature disposed in the substrate in a first process chamber via a chemical vapor deposition (CVD) process at a first temperature; depositing a second metallic material on the first metallic material in a second process chamber at a second temperature and at a first bias power to form a seed layer of the second metallic material; etching the seed layer in the second process chamber at a second bias power greater than the first bias power to form an intermix layer within the feature comprising the first metallic material and the second metallic material; and heating the substrate to a third temperature greater than the second temperature, causing a reflow of the second metallic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.