Inventor · San Jose, CA, US

Feng Chen

14Patents
1h-index
37Co-inventors
43Inventor score

Filing activity: Jun 7, 2019 → Dec 19, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US11164780B2 Process integration approach for selective metal via fill Electricity 1 Active
US11586160B2 Reducing substrate surface scratching using machine learning Physics 1 Active
US11764157B2 Ruthenium liner and cap for back-end-of-line applications Electricity 0 Active
US11527437B2 Methods and apparatus for intermixing layer for enhanced metal reflow Electricity 0 Active
US12148660B2 Low resistance and high reliability metallization module Electricity 0 Active
US12211743B2 Method of forming a metal liner for interconnect structures Electricity 0 Active
US11587873B2 Binary metal liner layers Electricity 0 Active
US12431358B2 Methods and materials for enhanced barrier performance and reduced via resistance Electricity 0 Active
US11835927B2 Reducing substrate surface scratching using machine learning Physics 0 Active
US11784127B2 Ruthenium liner and cap for back-end-of-line Electricity 0 Active
US12157943B2 Methods of selective deposition Electricity 0 Active
US11955382B2 Reverse selective etch stop layer Electricity 0 Active
US11939666B2 Methods and apparatus for precleaning and treating wafer surfaces Electricity 0 Active
US11171046B2 Methods for forming cobalt and ruthenium capping layers for interconnect structures Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.