Bump pad structure
US11527498B2 · kind B2 · utility
0Cited by
1References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Oct 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/0401
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Aspects disclosed herein include a device including a bump pad structure and methods for fabricating the same. The device includes a bump pad. The device also includes a first trace adjacent the bump pad, where a first trace top surface is recessed a first recess distance from a bump pad top surface. The device also includes a second trace adjacent the first trace, covered at least in part by a solder resist. The device also includes a substrate, where the bump pad, the first trace, and the second trace are each formed on a portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.