Patent · US Active

Deposition of charge trapping layers

US11532757B2 · kind B2 · utility

1Cited by
2,214References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 6, 2017
Grant dateDec 20, 2022
Priority date
Expiry dateOct 6, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/0413
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor device and method for manufacturing the semiconductor device are disclosed. Specifically, the semiconductor device may include a charge trapping layer with improved retention and speed for VNAND applications. The charge trapping layer may comprise an aluminum nitride (AlN) or aluminum oxynitride (AlON) layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.