Deposition of charge trapping layers
US11532757B2 · kind B2 · utility
1Cited by
2,214References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2017 |
| Grant date | Dec 20, 2022 |
| Priority date | — |
| Expiry date | Oct 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/0413
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and method for manufacturing the semiconductor device are disclosed. Specifically, the semiconductor device may include a charge trapping layer with improved retention and speed for VNAND applications. The charge trapping layer may comprise an aluminum nitride (AlN) or aluminum oxynitride (AlON) layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.