Optical diagnostics of semiconductor process using hyperspectral imaging
US11538723B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2020 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Nov 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed are embodiments of an improved apparatus and system, and associated methods for optically diagnosing a semiconductor manufacturing process. A hyperspectral imaging system is used to acquire spectrally-resolved images of emissions from the plasma, in a plasma processing system. Acquired hyperspectral images may be used to determine the chemical composition of the plasma and the plasma process endpoint. Alternatively, a hyperspectral imaging system is used to acquire spectrally-resolved images of a substrate before, during, or after processing, to determine properties of the substrate or layers and features formed on the substrate, including whether a process endpoint has been reached; or before or after processing, for inspecting the substrate condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.