Physical vapor deposition system and processes
US11542595B2 · kind B2 · utility
0Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Feb 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02266
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.