Thermal management solutions for integrated circuit packages

US11545407B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Kumar Abhishek Singh · Phoenix, US
• Omkar G. Karhade · Chandler, US
• Nitin A. Deshpande · Chandler, US
• Mitul Modi · Phoenix, US
• Edvin Cetegen · Chandler, US
• Aastha Uppal · Chandler, US
• Debendra Mallik · Chandler, US
• Sanka Ganesan · Chandler, US
• Yiqun Bai · Chandler, US
• Jan Krajniak · Mesa, US
• Manish Dubey · Chandler, US
• Ravindranath V. Mahajan · Chandler, US
• Ram Viswanath · Phoenix, US
• James C. Matayabas, Jr. · Chandler, US

Key dates

• Filing date: Jan 10, 2019
• Grant date: Jan 3, 2023
• Expiry date: May 4, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1811
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit device is electrically attached to the substrate; a mold material on the substrate and adjacent to the at least one integrated circuit device; and at least one heat dissipation structure contacting the at least one integrated circuit, wherein the at least one heat dissipation structure is embedded either within the mold material or between the mold material and the substrate.