Microelectronic devices, electronic systems having a memory array region and a control logic region, and methods of forming microelectronic devices
US11545456B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Aug 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1438
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device comprises a first die and a second die attached to the first die. The first die comprises a memory array region comprising a stack structure comprising vertically alternating conductive structures and insulative structures, vertically extending strings of memory cells within the stack structure, and first bond pad structures vertically neighboring the vertically extending strings of memory cells. The second die comprises a control logic region comprising control logic devices configured to effectuate at least a portion of control operations for the vertically extending string of memory cells, second bond pad structures in electrical communication with the first bond pad structures, and signal routing structures located at an interface between the first die and the second die. Related microelectronic devices, electronic systems, and methods are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.