Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

US11547030B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Gayatri Natu · Mumbai, IN
• Geetika Bajaj · New Delhi, IN
• Prerna Goradia · Mumbai, IN
• Darshan Thakare · Jamkhed, IN
• David Fenwick · Chelmsford, US
• Xiaoming He · Arcadia, US
• Sanni Seppaelae · Großwelzheim, DE
• Jennifer Y. Sun · Mountain View, US
• Rajkumar Thanu · Santa Clara, US
• Jeff Hudgens · San Francisco, US
• Karuppasamy Muthukamatchy · Madurai, IN
• Arun Kumar Dhayalan · Boise, US

Key dates

• Filing date: Jun 2, 2020
• Grant date: Jan 3, 2023
• Expiry date: Jun 2, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05F1/02
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.