Patent · US Active

Substrate processing apparatus and method of processing a substrate and of manufacturing a processed workpiece

US11551950B2 · kind B2 · utility

0Cited by

2References

22Claims

0Family size

Assignee

EVATEC AG · CH

Inventors

Hartmut Rohrmann · Schriesheim, DE
Heinz Felzer · Landquart, CH
Dominik Jaeger · Steinbach-Hallenberg, DE
Hubert Breuss · Feldkirch, AT

Key dates

Filing date	Nov 27, 2018
Grant date	Jan 10, 2023
Priority date	—
Expiry date	Jul 31, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/26
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A substrate processing apparatus includes a base with a process-side surface and a substrate support arranged on the process-side surface and designed to carry a substrate at its periphery. The periphery, more specifically the plane defined by the periphery, is spaced apart from the process-side surface. The substrate processing apparatus also includes a radiation sensor adapted to measure electromagnetic radiation arranged on a side of a back-side surface of the base. A radiation channel is arranged between the radiation sensor and the periphery of the substrate support, more specifically between the radiation sensor and the plane defined by the periphery, wherein the radiation channel is at least partially permeable to electromagnetic radiation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.