Patent · US Active

Asymmetric cored integrated circuit package supports

US11552008B2 · kind B2 · utility

1Cited by

3References

24Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Lauren A. Link · Mesa, US
Andrew J. Brown · Brier, US
Prithwish Chatterjee · Tempe, US
Sai Vadlamani · Chandler, US
Ying Wang · Taichung, TW
Chong Zhang · Chandler, US

Key dates

Filing date	Nov 28, 2018
Grant date	Jan 10, 2023
Priority date	—
Expiry date	May 13, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1536
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are asymmetric cored integrated circuit (IC) package supports, and related devices and methods. For example, in some embodiments, an IC package support may include a core region having a first face and an opposing second face, a first buildup region at the first face of the core region, and a second buildup region at the second face of the core region. A thickness of the first buildup region may be different than a thickness of the second buildup region. In some embodiments, an inductor may be included in the core region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.