Patent · US Active

Solder material with two different size nickel particles

US11552042B2 · kind B2 · utility

2Cited by

1References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexander Heinrich · Bad Abbach, DE
Alexander Roth · Griesheim, DE
Catharina Wille · Regensburg, DE

Key dates

Filing date	Dec 10, 2020
Grant date	Jan 10, 2023
Priority date	—
Expiry date	Mar 10, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/32225
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A solder material may include nickel and tin. The nickel may include first and second amounts of particles. A sum of the particle amounts is a total amount of nickel or less. The first amount is between 5 at % and 60 at % of the total amount of nickel. The second amount is between 10 at % and 95 at % of the total amount of nickel. The particles of the first amount have a first size distribution, the particles of the second amount have a second size distribution, 30% to 70% of the first amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the first size distribution, and 30% to 70% of the second amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the second size distribution.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.