System and method to control PVD deposition uniformity
US11557473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2020 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Oct 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A physical vapor deposition chamber comprising a tilting substrate support is described. Methods of processing a substrate are also provided comprising tilting at least one of the substrate and the target to improve the uniformity of the layer on the substrate from the center of the substrate to the edge of the substrate. Process controllers are also described which comprise one or more process configurations causing the physical deposition chamber to perform the operations of rotating a substrate support within the physical deposition chamber and tilting the substrate support at a plurality of angles with respect to a horizontal axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.