Test arrangement for testing high-frequency components, particularly silicon photonics devices under test
US11561242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2020 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Dec 2, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.