Method of temperature measurement used in radio-frequency processing apparatus for semiconductor
US11562891B2 · kind B2 · utility
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Key dates
| Filing date | Nov 29, 2019 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Dec 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2001
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for temperature measurement used in an RF processing apparatus for semiconductor includes generating by electrodes an RF signal sequence having multiple discontinuous RF signals that are separated by a time interval; and generating a temperature sensing signal by a thermal sensor during the time interval.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.