Systems and methods for semiconductor chip surface topography metrology
US11562919B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2020 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Feb 17, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J3/45
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals and a plurality of spectrum signals are received by at least one processor. Each of the interference signals and spectrum signals corresponds to a respective one of a plurality of positions on a surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.