Semiconductor device release during pick and place operations, and associated systems and methods
US11562922B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2022 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Jan 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67132
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for releasing semiconductor devices during pick and place operations are disclosed. A representative system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a release station having a fluid delivery device coupleable to a source of release fluid, the fluid delivery device having an exit positioned to direct release fluid toward a semiconductor die carried by the support member at the release station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.