Systems and methods for forming semiconductor cutting/trimming blades
US11565371B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 31, 2018 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Mar 4, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D15/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.