Testing system including active thermal interposer device

US11567119B2 · kind B2 · utility

Assignee

• Advantest Test Solutions, Inc. · US

Inventors

• Samer Kabbani · San Marcos, US
• Paul Ferrari · San Jose, US
• Ikeda Hiroki · Saitama, JP
• Kiyokawa Toshiyuki · Saitama, JP
• Gregory Cruzan · Anaheim, US
• Karthik Ranganathan · San Jose, US
• Todd Berk · Burbank, US
• Ian Williams · Talbert, US
• Mohammad Ghazvini · Laguna Niguel, US
• Thomas P. Jones · Escondido, US

Key dates

• Filing date: Nov 19, 2021
• Grant date: Jan 31, 2023
• Expiry date: Nov 19, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2868
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.