Support frame structure and manufacturing method thereof
US11569177B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2020 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | May 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a method for manufacturing a support frame structure and a support frame structure. The method includes steps of: providing a metal plate including a support region and an opening region; forming an upper dielectric hole and a lower dielectric hole respectively at an upper surface and a lower surface of the support region by photolithography, with a metal spacer connected between the upper dielectric hole and the lower dielectric hole; forming an upper metal pillar on an upper surface of the metal plate, and laminating an upper dielectric layer which covers the upper metal pillar and the upper dielectric hole; etching the metal spacer, forming a lower metal pillar on the lower surface of the metal plate, and laminating a lower dielectric layer which covers the lower metal pillar and the lower dielectric hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.