Multi-input multi-zone thermal control for device testing
US11573262B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2021 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Nov 19, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disposing a DUT between a cold plate and an active thermal interposer device of the thermal management head. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality zones by controlling a supply of coolant to a cold plate, and individually controlling heating of each zone of the plurality zones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.