Substrate processing apparatus and substrate processing method
US11574827B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2018 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Jul 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes: a processing unit including a holder that holds a substrate and rotates the substrate, a nozzle that ejects a processing liquid, and a conductive piping unit that supplies the processing liquid to the nozzle; a controller that causes the processing unit to execute a liquid processing in which the substrate is processed by supplying the processing liquid from the nozzle to the substrate that is held and rotated by the holder, and a measuring unit that measures a flowing current generated by the processing liquid flowing through the piping unit. The controller monitors the liquid processing based on a measurement result by the measuring unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.