Patent · US Active

Carrier, laminate and method of manufacturing semiconductor devices

US11576259B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Hans-Joachim Schulze · Taufkirchen, DE
Andre Brockmeier · Villach, AT
Tobias Franz Wolfgang Hoechbauer · Villach, AT
Gerhard Metzger-Brueckl · Geisenfeld, DE
Matteo Piccin · Villach, AT
Francisco Javier Santos Rodriguez · Villach, AT

Key dates

Filing date	Aug 23, 2019
Grant date	Feb 7, 2023
Priority date	—
Expiry date	Nov 26, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68327
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A carrier configured to be attached to a semiconductor substrate via a first surface comprises a continuous carbon structure defining a first surface of the carrier, and a reinforcing material constituting at least 2 vol-% of the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.