Susceptor wafer chucks for bowed wafers

US11581213B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Abhishek Chowdhury · Kanchinakote, IN
• Vijayabhaskara Venkatagiriyappa · Kanchinakote, IN
• Mihaela Balseanu · Sunnyvale, US
• Jyoti Prakash Deo · Kanchinakote, IN
• Srinivas Ramakrishna · Kanchinakote, IN
• Keiichi Tanaka · Toyama, JP
• Mandyam Sriram · Beaverton, US
• Francis Kanyiri Mungai · San Jose, US
• Mario David Silvetti · Fountain Hills, US
• Sriharish Srinivasan · Kanchinakote, IN

Key dates

• Filing date: Sep 23, 2020
• Grant date: Feb 14, 2023
• Expiry date: Apr 9, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68714
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Apparatus and methods for vacuum chucking a substrate to a susceptor. The susceptor comprises one or more angularly spaced pockets are positioned around a center axis of the susceptor, the one or more angularly spaced pockets having an inner pocket and an outer pocket. The susceptor can be configured as an intermediate chuck having one or more pucks positioned within the inner pocket or as a distributed chuck having one or more pucks positioned within the outer pocket. The one or more pucks has a center hole, at least one radial channel and at least one circular channel having chuck holes for vacuum chucking a substrate.