Circuit board
US11582872B2 · kind B2 · utility
0Cited by
4References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 6, 2019 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Nov 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.