Jian SHEN
5Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Nov 29, 2016 → Jun 6, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11160166B2 | Printed circuit board with high-capacity copper circuit | Emerging Cross-Sectional Technologies | 1 | Active |
| US10859293B2 | Mechanical vibration-isolated, liquid helium consumption-free and extremely low temperature refrigerating system | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US9907167B1 | Method for manufacturing a printed circuit board with high-capacity copper circuit | Emerging Cross-Sectional Technologies | 0 | Active |
| US10539590B2 | High magnetic field scanning probe microscope employing liquid helium-free room-temperature bore superconducting magnet | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US11582872B2 | Circuit board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.