Molded laser package with electromagnetic interference shield and method of making
US11587882B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2021 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Feb 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a substrate comprising a carrier and an interposer disposed on the carrier. An electrical component is disposed over a first surface of the interposer. An interconnect structure is disposed over the first surface of the interposer. An encapsulant is deposited over the electrical component, interconnect structure, and substrate. A trench is formed through the encapsulant and interposer into the carrier. A shielding layer is formed over the encapsulant and into the trench. The carrier is removed after forming the shielding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.