Method of processing workpiece and resin sheet unit
US11590629B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2019 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Oct 20, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/228
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of processing a workpiece includes sticking an adhesive layer side of a resin sheet having a layered structure that includes the adhesive layer and a base material layer, to a support base, forming surface irregularities on a face side of the base material layer that is opposite the adhesive layer; placing a face side of the workpiece and the face side of the base material layer in facing relation to each other and pressing the workpiece against the resin sheet or pressing the resin sheet against the workpiece, thereby bringing the workpiece into intimate contact with the resin sheet to fix the workpiece to the resin sheet; holding a surface of the support base that is opposite the resin sheet on a holding surface of a chuck table, and grinding a reverse side of the workpiece with a grinding stone disposed in facing relation to the holding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.