Substrate treating apparatus and substrate treating method
US11594421B2 · kind B2 · utility
0Cited by
7References
15Claims
0Family size
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Key dates
| Filing date | Sep 24, 2020 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Sep 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.