Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
US11594432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2021 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | May 8, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.